 | 108974-00 | Heat Sink for Select Intel Boxed Processors, PCN 108974-00, Product Material, Machine Surface Modification | Desktop Processors, Server Processors | 895734 | BX80570E8200 S LAPP | | | S LAPP | |
| 108934-00 | Land Grid Array (LGA) Microprocessor, LGA771/LGA775/FC-LGA6 Cover Removal, PCN 108934-00, Product Material | Desktop Processors, Embedded Processors, Mobile Processors, Server Processors | 895734 | BX80570E8200 S LAPP | | | S LAPP | |
| 108966-00 | Intel(R) Core(TM)2 Duo Processors E8200 & E8190, PCN 108966-00, Product Discontinuance, Product Discontinuance for Tray and Boxed Products | Desktop Processors | 895734 | BX80570E8200 S LAPP | | | S LAPP | |
| 108966-00 | Intel(R) Core(TM)2 Duo Processors E8200 & E8190, PCN 108966-00, Product Discontinuance, Product Discontinuance for Tray and Boxed Products | Desktop Processors | 895734 | BX80570E8200 S LAPP | | | S LAPP | |
| 108112-01 | All Intel(R) Component Products shipped in JEDEC trays using the Intermediate Box (I-Box) Packaging, PCN 108112-01, Transport Media, Added Handle with Care graphics to the I-box., Reason for Revision: Added customers for notification | Desktop Processors, Embedded Processors, Microcontrollers, Mobile Processors, Networking Products, Server Processors, Chipsets - Desktop, Chipsets - Workstation Server, Chipsets - Mobile | 895734 | BX80570E8200 S LAPP | | | S LAPP | |
Worldwide
