 | 108974-00 | 11/21/2008 | Heat Sink for Select Intel Boxed Processors, PCN 108974-00, Product Material, Machine Surface Modification | Product Material | Desktop Processors, Server Processors | Desktop Processors, Server Processors, Product Material, Intel anticipates no impact to customers, see PCN detail for further information. |
 | 108934-00 | 11/14/2008 | Land Grid Array (LGA) Microprocessor, LGA771/LGA775/FC-LGA6 Cover Removal, PCN 108934-00, Product Material | Product Material | Desktop Processors, Embedded Processors, Mobile Processors, Server Processors | Desktop Processors, Embedded Processors, Mobile Processors, Server Processors, Product Material, Intel anticipates no impact to customers, see PCN detail for further information. |
 | 108574-00 | 06/26/2008 | Boxed Intel(R) Core(TM)2 Duo Processor E8500, E8400 and Boxed Dual-Core Intel(R) Xeon(R) Processor E3110, PCN 108574-00, Product Design, C-0 to E-0 Core Stepping Conversion | Product Design | Desktop Processors, Server Processors | Desktop Processors, Server Processors, Product Design, Customers to place future orders using new order code, see details in PCN. |
 | 108112-01 | 12/14/2007 | All Intel(R) Component Products shipped in JEDEC trays using the Intermediate Box (I-Box) Packaging, PCN 108112-01, Transport Media, Added Handle with Care graphics to the I-box., Reason for Revision: Added customers for notification | Transport Media | Desktop Processors, Embedded Processors, Microcontrollers, Mobile Processors, Networking Products, Server Processors, Chipsets - Desktop, Chipsets - Workstation Server, Chipsets - Mobile | Chipsets - Desktop, Chipsets - Mobile, Chipsets - Workstation Server, Desktop Processors, Embedded Processors, Microcontrollers, Mobile Processors, Networking Products, Server Processors, Transport Media, Intel anticipates no impact to customers, see PCN |