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12
Click to expand all rows.PCN NumberPublish DatePCN TitleKey CharacteristicsProduct CategoriesAbstract
108974-0011/21/2008
Heat Sink for Select Intel Boxed Processors, PCN 108974-00, Product Material, Machine Surface Modification
Product Material
Desktop Processors, Server Processors
Desktop Processors, Server Processors, Product Material, Intel anticipates no impact to customers, see PCN detail for further information.
108934-0011/14/2008
Land Grid Array (LGA) Microprocessor, LGA771/LGA775/FC-LGA6 Cover Removal, PCN 108934-00, Product Material
Product Material
Desktop Processors, Embedded Processors, Mobile Processors, Server Processors
Desktop Processors, Embedded Processors, Mobile Processors, Server Processors, Product Material, Intel anticipates no impact to customers, see PCN detail for further information.
108574-0006/26/2008
Boxed Intel(R) Core(TM)2 Duo Processor E8500, E8400 and Boxed Dual-Core Intel(R) Xeon(R) Processor E3110, PCN 108574-00, Product Design, C-0 to E-0 Core Stepping Conversion
Product Design
Desktop Processors, Server Processors
Desktop Processors, Server Processors, Product Design, Customers to place future orders using new order code, see details in PCN.
108112-0112/14/2007
All Intel(R) Component Products shipped in JEDEC trays using the Intermediate Box (I-Box) Packaging, PCN 108112-01, Transport Media, Added Handle with Care graphics to the I-box., Reason for Revision: Added customers for notification
Transport Media
Desktop Processors, Embedded Processors, Microcontrollers, Mobile Processors, Networking Products, Server Processors, Chipsets - Desktop, Chipsets - Workstation Server, Chipsets - Mobile
Chipsets - Desktop, Chipsets - Mobile, Chipsets - Workstation Server, Desktop Processors, Embedded Processors, Microcontrollers, Mobile Processors, Networking Products, Server Processors, Transport Media, Intel anticipates no impact to customers, see PCN
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