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Document by Parts
Click to expand all rows.PCN NumberPublish DatePCN TitleKey CharacteristicsProduct CategoriesAbstract
118908-0002/25/2022
1U 8x2.5 inch SAS/NVMe Hot Swap Backplane F1U8X25S3PHS, Single, 2U 12x3.5inch SAS and 2x NVMe Hot Swap Backplane F2U12X35S3PH, Single, 2U Hot-swap 8x2.5inch SAS/NVMe Combo Drive Bay Kit A2U8X25S3PHS, Single, PCN 118908-00, Product Material, New Alternate
Product Material
Server Boards and Platforms, Server Processors
Server Boards and Platforms, Server Processors, Product Material, Intel anticipates no impact to customers, see PCN detail for further information.
118893-0002/03/2022
2U 12x3.5inch SAS and 2x NVMe Hot Swap Backplane F2U12X35S3PH, 1U 8x2.5 inch SAS/NVMe Hot Swap Backplane F1U8X25S3PHS, 2U Hot-swap 8x2.5inch SAS/NVMe Combo Drive Bay Kit A2U8X25S3PHS , PCN 118893-00, Product Material, New Alternate Hot Swap Backplane
Product Material
Server Boards and Platforms
Server Boards and Platforms, Product Material, Intel anticipates no impact to customers, see PCN detail for further information.
118696-0112/08/2021
Select Hot Swap Backplane F2U8X25S3PHS and F1U8X25S3PHS, PCN 118696-01, Product Design, HSBP interposer implementation, Reason for Revision: Reason for Revision: Updating description of change and Products Affected table
Product Design
Server Boards and Platforms
Server Boards and Platforms, Product Design, Intel anticipates no impact to customers, see PCN detail for further information.