 | 118532-00 | 10/01/2021 | Select Intel(R) FPGA devices, PCN 118532-00, Product Design, Discontinuance of Selected Intel(R) Quartus(R) II and Intel(R) Quartus(R) Prime Software Subscription & Web Editions | Product Design | FPGA (Field-Programmable Gate Array) | FPGA (Field-Programmable Gate Array), Product Design, Intel anticipates no impact to customers, see PCN detail for further information. |
| 118147-01 | 07/13/2021 | MINOR CHANGE: Transport Media Country of Origin (COO) Label Value Change for Products Assembled in South Korea, PCN 118147-01, Transport Media, Label, Standardize the Country of Origin (COO) value displayed on Labels, Reason for Revision: Updated Scope to | Transport Media | Desktop Processors, Embedded Processors, Mobile Processors, Server Processors, Chipsets - Desktop, Chipsets - Workstation Server, Chipsets - Mobile, Chipsets - Mobile IMC, Connected Home, FPGA (Field-Programmable Gate Array) | Chipsets - Desktop, Chipsets - Mobile, Chipsets - Mobile IMC, Chipsets - Workstation Server, Connected Home, Desktop Processors, Embedded Processors, FPGA (Field-Programmable Gate Array), Mobile Processors, Server Processors, Transport Media, Intel antici |
| 118143-01 | 06/03/2021 | Select Intel(R) FPGA devices, PCN 118143-01, Product Design, Intel(R) Quartus(R) Prime Standard Edition Software Update, Reason for Revision: Updated Table 1 content | Product Design | FPGA (Field-Programmable Gate Array) | FPGA (Field-Programmable Gate Array), Product Design, Intel anticipates no impact to customers, see PCN detail for further information. |
| 118153-00 | 03/23/2021 | Cyclone(R) V and Arria(R) V Devices, PCN 118153-00, Product Design, Pin Connection Guidelines Update | Product Design | FPGA (Field-Programmable Gate Array) | FPGA (Field-Programmable Gate Array), Product Design, Intel anticipates no impact to customers, see PCN detail for further information. |
| 118112-00 | 03/09/2021 | MINOR CHANGE: Changes added to the Thermal Form Trays (TFTs), PCN 118112-00, Transport Media, Adding Human Readable Identifier & Changing Percentage of Post Consumer Recycled Plastic Used in Composition of Trays | Transport Media | Desktop Processors, Embedded Processors, Mobile Processors, Server Processors, Consumer Electronics, Chipsets - Desktop, Chipsets - Workstation Server, Chipsets - Mobile, Chipsets - Mobile IMC, Automotive, Compute Module, FPGA (Field-Programmable Gate Ar | Automotive, Chipsets - Desktop, Chipsets - Mobile, Chipsets - Mobile IMC, Chipsets - Workstation Server, Compute Module, Consumer Electronics, Desktop Processors, Embedded Processors, FPGA (Field-Programmable Gate Array), Mobile Processors, Server Process |
| 117758-00 | 11/24/2020 | MINOR CHANGE
Packaging Change Made to Intermediate Box (I-Box) Cardboard Flaps for Closure and Intel Logo Change on i-Box, PCN 117758-00, Transport Media, Product Material, Transport Media, Half NSD I-Box Overlap Inner Flap design change + Logo Change | Transport Media | Desktop Processors, Embedded Processors, Mobile Processors, Server Processors, Chipsets - Desktop, Chipsets - Workstation Server, Chipsets - Mobile, Chipsets - Mobile IMC, Compute Module, FPGA (Field-Programmable Gate Array) | Chipsets - Desktop, Chipsets - Mobile, Chipsets - Mobile IMC, Chipsets - Workstation Server, Compute Module, Desktop Processors, Embedded Processors, FPGA (Field-Programmable Gate Array), Mobile Processors, Server Processors, Transport Media, Intel antici |
| 117840-00 | 10/22/2020 | Intel(R) SoC FPGA (Arm* DS for Intel(R) SoC FPGA), PCN 117840-00, Product Design, Discontinuance of Arm* Development Studio 5 (DS-5) Intel(R) SoC FPGA Edition and migration to Arm* Development Studio | Product Design | FPGA (Field-Programmable Gate Array) | FPGA (Field-Programmable Gate Array), Product Design, Intel anticipates no impact to customers, see PCN detail for further information. |
| 116563-01 | 01/31/2019 | Humidity Indicator Card (HIC) Relocation & Desiccant Pouch Reduction, PCN 116563-01, Transport Media, Reducing the Number of Full I-Box Desiccant Pouches used and Relocating the Placement of the Humidity Indicator Card (HIC) on all Desiccant Packed Produc | Transport Media | Desktop Processors, Embedded Processors, Mobile Processors, Server Processors, Wireless Products, Consumer Electronics, Chipsets - Desktop, Chipsets - Workstation Server, Chipsets - Mobile, Chipsets - Mobile IMC, Ultra Mobility, Automotive, ICF - Intel C | Automotive, Chipsets - Desktop, Chipsets - Mobile, Chipsets - Mobile IMC, Chipsets - Workstation Server, Consumer Electronics, Desktop Processors, Embedded Processors, ICF - Intel Custom Foundry, Mobile Processors, Server Processors, Ultra Mobility, Wirel |