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Click to expand all rows.PCN NumberPublish DatePCN TitleKey CharacteristicsProduct CategoriesAbstract
118993-0003/28/2022
Intel(R) Server System R2208WFQZSR, PCN 118993-00, Product Material, Product Design, New Alternate Hot Swap Backplane and Gasket implementation in 2.5" tool less carrier
Product Material
Server Boards and Platforms, Server Chassis
Server Boards and Platforms, Server Chassis, Product Material, Intel anticipates no impact to customers, see PCN detail for further information.
117473-0003/11/2020
Hot-swap A2U8X25S3PHS, Intel(R) Server System R2208WF0ZSR, Intel(R) Server System R2208WFQZSR, Intel(R) Server System R2208WFTZSR, Intel(R) Server System R2224WFTZSR,, PCN 117473-00, Product Design, Product Material, Capacitor cut out
Product Design
Server Boards and Platforms, Server - Thermal Solutions
Server - Thermal Solutions, Server Boards and Platforms, Product Design, Customers may want to perform re-qualification, re-test, re-certification or standard validation testing for this change; see sample detail in PCN where applicable.
117389-0001/10/2020
Intel(R) Server System R2208WFQZSR, PCN 117389-00, Product Design, Label, 1300W PSU Temperature Sensor relocation, BIOS/ME/BMC Firmware Update
Product Design
Server Boards and Platforms
Server Boards and Platforms, Product Design, Intel anticipates no impact to customers, see PCN detail for further information.
117002-0006/17/2019
Intel(R) Server System R2208WFTZS, Intel(R) Server System R2208WFQZSR , PCN 117002-00, Label, System outer box J33994-001 stacking logo update
Label
Server Boards and Platforms, Server Chassis
Server Boards and Platforms, Server Chassis, Label, Intel anticipates no impact to customers, see PCN detail for further information.