 | 118993-00 | 03/28/2022 | Intel(R) Server System R2208WFQZSR, PCN 118993-00, Product Material, Product Design, New Alternate Hot Swap Backplane and Gasket implementation in 2.5" tool less carrier | Product Material | Server Boards and Platforms, Server Chassis | Server Boards and Platforms, Server Chassis, Product Material, Intel anticipates no impact to customers, see PCN detail for further information. |
 | 117473-00 | 03/11/2020 | Hot-swap A2U8X25S3PHS, Intel(R) Server System R2208WF0ZSR, Intel(R) Server System R2208WFQZSR, Intel(R) Server System R2208WFTZSR, Intel(R) Server System R2224WFTZSR,, PCN 117473-00, Product Design, Product Material, Capacitor cut out | Product Design | Server Boards and Platforms, Server - Thermal Solutions | Server - Thermal Solutions, Server Boards and Platforms, Product Design, Customers may want to perform re-qualification, re-test, re-certification or standard validation testing for this change; see sample detail in PCN where applicable. |
 | 117389-00 | 01/10/2020 | Intel(R) Server System R2208WFQZSR, PCN 117389-00, Product Design, Label, 1300W PSU Temperature Sensor relocation, BIOS/ME/BMC Firmware Update | Product Design | Server Boards and Platforms | Server Boards and Platforms, Product Design, Intel anticipates no impact to customers, see PCN detail for further information. |
 | 117002-00 | 06/17/2019 | Intel(R) Server System R2208WFTZS,
Intel(R) Server System R2208WFQZSR
, PCN 117002-00, Label, System outer box J33994-001 stacking logo update | Label | Server Boards and Platforms, Server Chassis | Server Boards and Platforms, Server Chassis, Label, Intel anticipates no impact to customers, see PCN detail for further information. |